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Thermal Emission Microscopy (Coming Soon!)

Thermal Emission Microscopy is a semiconductor failure analysis technique that pinpoints failures by detecting thermal emissions generated within the semiconductor device. The increasing trend toward hyperfine patterns and lower supply voltages in semiconductor devices makes the infrared rays emitted by heat generated from semiconductor failure points fainter and more difficult to detect.

Thermogravimetric Analysis (TGA)

Thermogravimetric analysis or thermal gravimetric analysis (TGA) is a method of thermal analysis. TGA can measure the mass of a sample while temperature changes over time. Mass, temperature, and time are considered base measurements but many additional measures may also be derived from these three base measurements.

This measurement provides information about:

Physical Phenomena

  • Phase Transitions
  • Absorption
  • Desorption

Chemical Phenomena

  • Chemisorptions
  • Thermal Decomposition
  • Solid-gas Reactions (e.g., oxidation or reduction).

Differential Scanning Calorimetry (DSC) Analysis

Differential scanning calorimetry (DSC) analysis is a thermoanalytical technique in which the difference in the amount of heat required to increase the temperature of a sample and reference is measured as a function of temperature. Both the sample and reference are maintained at nearly the same temperature throughout the experiment.

Generally, the temperature program for a DSC analysis is designed such that the sample holder temperature increases linearly as a function of time. The reference sample should have a well-defined heat capacity over the range of temperatures to be scanned.

Applications:

  • Melting and crystallization behavior
  • Glass transition temperatures
  • Specific heat capacity
  • Kinetic studies
  • Transition and reaction enthalpies

Electron Backscatter Diffraction (EBSD) Analysis

Electron Backscatter Diffraction (EBSD) Analysis is a characterization technique used to determine the crystalline structure and crystallographic orientation of a material. It produces a result called Kikuchi Patterns or Electron Backscatter Patterns (EBSP) to see its structure.

EBSD analysis technique provides quantitative microstructural information about the crystallographic nature of metals, minerals, semiconductors, and ceramics. It reveals grain, size, grain boundary character, grain orientation, texture, and phase identity of the sample under the beam.

X-ray Fluorescence Spectroscopy (XRF)

X-ray Fluorescence Spectroscopy (XRF) is an analytical technique that uses x-rays to scan samples in order to determine their elemental composition.

X-ray Fluorescence Spectroscopy (XRF) can also be used as a RoHS (Restriction on Hazardous Substances) screening tool. Kindly see our RoHS Screening Analysis using XRF service (Click Here).

Capable Elements:

  • Aluminum to Uranium

Applications:

  • Semiconductors and Electronics (e.g. Integrated circuit (IC), LED, Pins, etc.)
  • Environmental Analysis (e.g. soil, sand, plant leaves, etc.)
  • Metallurgy and Mining (e.g. Coating, Alloy, Gold, etc.)
  • Polymers (e.g. plastics, packaging, toys, etc.)

Sample Types and Requirements:

  • Solid – Min Size: 1.2mm (Millimeters)
  • Liquid – 5mg (Milligrams)
  • Powder – 5g (Grams)

Equipment used: