Mechanical Cross Section
Mechanical cross sectioning is a sample preparation technique used to expose internal structures of materials and devices by physically cutting through them. This method is essential for examining layer interfaces, defects, and structural integrity in components such as PCBs, semiconductors, and multilayer materials. The process typically involves precision cutting, grinding, and polishing to produce a […]
Ion Sputtering
Ion sputtering is a physical process used to remove or deposit material from a surface by bombarding it with high-energy ions, typically in a vacuum environment. It is widely used in thin film deposition, surface cleaning, and sample preparation for analytical techniques such as SEM, TEM, and SIMS. In thin film applications, ion sputtering enables […]
Hybrid Ion Milling (Cross Section & Flat Milling)
Hybrid Ion Milling is a precision sample preparation technique used to produce high-quality cross-sectional and flat surfaces for advanced imaging and analysis. It utilizes a focused ion beam to gently remove material, minimizing mechanical damage and preserving microstructural integrity. Cross section milling reveals internal layers and interfaces, while flat milling removes surface deformation and polishing […]
Grinding and Polishing
Grinding and polishing are essential sample preparation techniques used to produce flat, smooth surfaces for microscopic and analytical examination. These processes remove surface irregularities, scratches, and deformation layers, enabling accurate imaging and measurement in techniques such as SEM, EBSD, EDS, and optical microscopy. We offer both manual and automated preparation methods, tailored to the material […]