Some of the key applications of these techniques are:
- Topside electronic de-processing – enabled by the advanced angular control and optical enhancements.
- Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces.
- Cross-sectioning of die and package-level devices.
- These techniques are crucial in industries like semiconductors, electronics, and materials science, helping ensure the quality and reliability of various components and devices.
These techniques are crucial in industries like semiconductors, electronics, and materials science, helping ensure the quality and reliability of various components and devices.