Hybrid Ion Milling is a precise technique used to remove the top amorphous layer of a material, revealing a pristine sample surface ideal for high-resolution imaging and post-processing. This method is essential for various advanced analytical techniques, including Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) studies.
Key Applications:
- Cross Section Milling: This application involves creating a cross-sectional view of the sample, which is crucial for examining the internal structure and interfaces of materials. It provides detailed insights into the composition and integrity of the sample.
- Flat Milling: This technique is used to prepare flat, smooth surfaces, which are necessary for high-resolution imaging and accurate analysis. It ensures that the sample surface is free from artifacts and distortions, enabling precise measurements and observations.
Hybrid Ion Milling is widely used in materials science, semiconductor research, and failure analysis. By providing a clean and undistorted sample surface, it enhances the accuracy and reliability of subsequent analytical techniques, making it an invaluable tool in both research and industrial applications.