Sample Preparation

Non-conductive samples often experience a charging effect due to the accumulation of electrons on their surface, which can interfere with obtaining high-quality images. Ion Sputtering coating addresses this issue by allowing imaging at higher beam energies, thereby achieving the highest resolution and magnification without the concern of electron charge effects or beam damage to sensitive samples.

Key Benefits:

• Enhanced Imaging Quality: By mitigating the charging effect, Ion Sputtering enables clearer and more detailed imaging of non-conductive samples.
• Protection of Sensitive Samples: This technique prevents beam damage, ensuring that delicate samples remain intact during analysis.
• Versatility: Ion Sputtering is applicable to a wide range of materials, making it a valuable tool in various fields such as materials science, electronics, and biological research.

Ion Sputtering is an essential preparation step for advanced imaging techniques, ensuring that samples are well-prepared for high-resolution analysis and accurate data collection.

Hybrid Ion Milling is a precise technique used to remove the top amorphous layer of a material, revealing a pristine sample surface ideal for high-resolution imaging and post-processing. This method is essential for various advanced analytical techniques, including Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) studies.

Key Applications:

• Cross Section Milling: This application involves creating a cross-sectional view of the sample, which is crucial for examining the internal structure and interfaces of materials. It provides detailed insights into the composition and integrity of the sample.
• Flat Milling: This technique is used to prepare flat, smooth surfaces, which are necessary for high-resolution imaging and accurate analysis. It ensures that the sample surface is free from artifacts and distortions, enabling precise measurements and observations.

Hybrid Ion Milling is widely used in materials science, semiconductor research, and failure analysis. By providing a clean and undistorted sample surface, it enhances the accuracy and reliability of subsequent analytical techniques, making it an invaluable tool in both research and industrial applications.

Some of the key applications of these techniques are:

• Topside electronic de-processing – enabled by the advanced angular control and optical enhancements.
• Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces.
• Cross-sectioning of die and package-level devices.
• These techniques are crucial in industries like semiconductors, electronics, and materials science, helping ensure the quality and reliability of various components and devices.

These techniques are crucial in industries like semiconductors, electronics, and materials science, helping ensure the quality and reliability of various components and devices.

Mechanical Cross Section is a critical failure analysis technique used to examine the internal structure of a sample orthogonal to its surface. This method involves precise cutting or grinding to expose a cross-sectional view of the material, providing valuable insights into its composition and integrity.

Key Methods:

• Diamond Wheel Cutting: Utilizes a diamond-coated wheel to achieve precise and clean cuts, ideal for hard materials.
• Abrasive Paper Grinding: Involves grinding the sample with abrasive paper to gradually expose the cross-section, suitable for a variety of materials.

Applications:

• Failure Analysis: Identifies defects, cracks, and other anomalies within the sample, aiding in the diagnosis of failure mechanisms.
• Quality Control: Ensures the structural integrity and consistency of materials, crucial for manufacturing and production processes.
• Material Characterization: Provides detailed information about the internal structure, grain boundaries, and phase distribution of the sample.

After Mechanical Cross Sectioning, the sample can undergo various advanced analytical techniques such as Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray (EDS) analysis. These techniques further enhance the understanding of the material’s properties and behavior, making Mechanical Cross Section an indispensable tool in research and industrial applications.