Failure Analysis Techniques for Semiconductor Devices (FA101)

About the Image: Failure Analysis Techniques Training (FA101) at NASAT Labs, Muntinlupa, Philippines

About this Training

This course is a lecture-discussion on the failure analysis techniques in semiconductor devices. This will cover topics from electrical characterization of MOSFET (Igss, Idss, Bvdss etc), non-destructive, destructive analysis up to the application of Photon emission, Optical Beam Induced Resistance Change (OBIRCH), Thermal Emission to failure isolation. Practical tips based on actual experience of the resource speaker will be shared in the training.

About the Speaker

Engr. Marlon Llana, M. Sce. Eng.

Technical and Operations Director, NASAT Labs

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Engr. Marlon Llana has a B.S. and a Masters’ degree in Chemical Engineering from Mapua Institute of Technology and is a PhD Candidate for Material Science and Engineering. He has over 20 years of experience in the semiconductor industry in the field of Quality, R&D, Laboratory Operation, Electro-plating, Failure Analysis, and Reliability having worked for Philips Semiconductors, SunPower Mfg. Ltd., International Rectifier, and DECA Technologies. He is a former faculty at Malayan College Laguna, Lyceum of the Philippines Laguna, and Colegio de San Juan de Letran having taught for more than 14 years. He is also a technical assessor of DTI-PAB for ISO/IEC17025 and is a member of the DTI Technical committee for nanotechnology.

Training Schedule

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Customer-site trainings and private webinar trainings are available.
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