Analytical tools

Scanning Electron Microscopy (SEM) imaging is a versatile characterization technique used to analyze a wide variety of samples, including membranes, filters, coins, and even biological specimens such as plant leaves and insects. The Scanning Electron Microscope (SEM) employs electron beams to capture high-resolution images, enabling detailed observation of surface morphology, topography, cracks, failures, and other microscopic features from the micron to the nanoscale level.

Key Applications:

• Surface Morphology and Topography: SEM provides detailed images of the surface structure and texture of samples, revealing fine details that are not visible with traditional optical microscopy.
• Failure Analysis: Identifies and examines cracks, defects, and other failure mechanisms in materials, aiding in the diagnosis and prevention of material failures.
• Biological Sample Analysis: Enables the study of biological specimens, such as plant leaves and insects, at high magnifications, providing insights into their microstructures and functions.
• Material Characterization: Analyzes the composition and properties of various materials, including metals, polymers, and ceramics, to understand their behavior and performance.

SEM imaging is an essential tool in research and industrial applications, offering unparalleled resolution and depth of field. It is widely used in fields such as materials science, electronics, biology, and quality control, providing critical information for both fundamental studies and practical applications.

Restriction of Hazardous Substances (RoHS) is a directive on the restrictions to use harmful elements such as:

• Lead (Pb)
• Cadmium (Cd)
• Mercury (Hg)
• Chromium (Cr)
• Plastics with Bromine (Br) such as Polybrominated biphenyl (PBB) and Polybrominated diphenyl ethers (PBDE)

By using X-ray Fluorescence Spectroscopy (XRF), we can quickly determine the levels of hazardous substances.

Thermal Emission Microscopy is a semiconductor failure analysis technique that pinpoints failures by detecting thermal emissions generated within the semiconductor device. The increasing trend toward hyperfine patterns and lower supply voltages in semiconductor devices makes the infrared rays emitted by heat generated from semiconductor failure points fainter and more difficult to detect.

Thermogravimetric analysis or thermal gravimetric analysis (TGA) is a method of thermal analysis. TGA can measure the mass of a sample while temperature changes over time. Mass, temperature, and time are considered base measurements but many additional measures may also be derived from these three base measurements.

This measurement provides information about:

Physical Phenomena

• Phase Transitions
• Absorption
• Desorption

Chemical Phenomena

• Chemisorptions
• Thermal Decomposition
• Solid-gas Reactions (e.g., oxidation or reduction).

Differential scanning calorimetry (DSC) analysis is a thermoanalytical technique in which the difference in the amount of heat required to increase the temperature of a sample and reference is measured as a function of temperature. Both the sample and reference are maintained at nearly the same temperature throughout the experiment.

Generally, the temperature program for a DSC analysis is designed such that the sample holder temperature increases linearly as a function of time. The reference sample should have a well-defined heat capacity over the range of temperatures to be scanned.

Applications:

• Melting and crystallization behavior
• Glass transition temperatures
• Specific heat capacity
• Kinetic studies
• Transition and reaction enthalpies

Electron Backscatter Diffraction (EBSD) Analysis is a characterization technique used to determine the crystalline structure and crystallographic orientation of a material. It produces a result called Kikuchi Patterns or Electron Backscatter Patterns (EBSP) to see its structure.

EBSD provides comprehensive quantitative microstructural information about the crystallographic nature of metals, minerals, semiconductors, and ceramics. It allows for the detailed analysis of grain size, grain boundary character, grain orientation, texture, and phase identity of the sample under the electron beam. This technique is essential for understanding material properties and behavior, making it invaluable in research and industrial applications.