Thermal Analysis Techniques (TAT101) course is a lecture-discussion of the four thermal analysis techniques in characterizing polymers. These are the Differential Scanning Calorimetry (DSC), Thermal Gravimetric Analysis (TGA), Differential Thermal Analysis (DTA) and Thermo-Mechanical Analysis (TMA).
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Infrared Optical Beam Induced Resistance Change (IR OBIRCH) (OB101) covers lectures on theories and application of emission microscopy techniques such as Photon Emission Microscopy, Thermal Emission Microscopy and Optical Beam Induced Resistance Change. This also involves hands-on operation of IR-OBIRCH. Practical tips based on actual experience of the resource speaker will be shared in the training.
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This course is a lecture and hands-on discussion on the materialographic preparation techniques such as cross sectioning, grinding, polishing, lapping, mechanical delayering, and ion milling. The participant will be able use a precision grinder polisher and learn how to prepare the samples precisely and with high quality. They will learn the theory and various method of sample preparation. They will also utilize a more advance technique using Ion Milling to prepare soft and difficult samples prior inspection. Thus, also have the opportunity to learn the basics of SEM (Scanning Electron Microscope) imaging and the use of Electron Backscatter Diffraction (EBSD).
Fractography is the study of fracture surfaces in-order-to determine the relation between the microstructure and the mechanism(s) of crack initiation and propagation and, eventually, the root cause of the fracture.
This course covers lecture on theories and application of emission microscopy techniques such as Photon Emission Microscopy, Thermal Emission Microscopy and Optical Beam Induced Resistance Change. This also involves hands-on operation of IR-OBIRCH. Practical tips based on actual experience of the resource speaker will be shared in the training.
This course is a lecture-discussion on the failure analysis techniques in semiconductor devices. This will cover topics from electrical characterization of MOSFET (Igss, Idss, Bvdss etc), non-destructive, destructive analysis up to the application of Photon emission, Optical Beam Induced Resistance Change (OBIRCH), Thermal Emission to failure isolation. Practical tips based on actual experience of the resource speaker will be shared in the training.
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