With this course, the participant will become familiar with the basic principles and applications of SEM-EDS. Become knowledgeable in the capability and limitations of SEM-EDS and be able to acquire SEM-EDS data and do basic interpretation.
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Non-Conductive samples often have a charging effect from electrons building up on the surface causing issues with collecting a good image. Ion Sputtering coating allows imaging at higher beam energies to obtain the highest resolution and magnification without concern of electron charge effects or beam damage to sensitive samples.
Ion milling is the process of removing the top amorphous layer on a material to reveal the pristine sample surface for high-resolution imaging and post-processing. It is essential in many cases such as Scanning Electron Microscopy (SEM) and Electron Back Scattered Diffraction (EBSD) studies.
Some of the key applications of these techniques are:
Mechanical Cross Section is a failure analysis technique used to examine the structure of a sample orthogonal to the surface. Methods include using a diamond wheel or grinding with abrasive paper. After Mechanical Cross Sectioning, the sample could undergo different analytical techniques such as Scanning Electron Microscopy and Energy Dispersive X-Ray.
Thermal Emission Microscopy is a semiconductor failure analysis technique that pinpoints failures by detecting thermal emissions generated within the semiconductor device. The increasing trend toward hyperfine patterns and lower supply voltages in semiconductor devices makes the infrared rays emitted by heat generated from semiconductor failure points fainter and more difficult to detect.
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© Copyright 2024 NASAT Labs
NASAT Labs (Nanotech Analytical Services And Training Corp.) is the first independent nanotechnology laboratory in the Philippines. We provide failure analysis, material characterization, water testing, environmental testing, and technical trainings to the semiconductor, electronics and allied industries.
